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Insulation Diameter Min: 1
TDK - CGA3E2C0G1H272J080AA - SMD Multilayer Ceramic Capacitor
MULTICOMP - TEST-1(BU) - PCB Test Point
13 Contacts
FIBOX - PCM 100/75 G ENCLOSURE - Plastic Enclosure
DF57H-6P-1.2V(21) Connector, Header, 6Pos, 1ROW, 1.2mm Hirose(Hrs) Insulation Diameter Min: 1HIROSE(HRS) DF57H 6P 1. 2V(21) Pin Header, Wire to Board, 1. 2 mm, 1 Rows, 6 Contacts, Surface Mount, DF57 Pitch Spacing: 1. 2mm No. of Contacts: 6Contacts Gender: Header Product Range: DF57 Series Contact Termination Type: Surface Mount No. of Rows: 1Rows Contact Plating: Tin Plated Contacts Contact Material: Brass SVHC: No SVHC (15 Jan 2019)
