Pay in 4 interest-free payments of $8.50 Learn more
Ships within 48 hours · Estimated delivery Sep 3 - Sep 8
Line Lenght≈420mm
Suitable for most mobile phone screen separation
2 FCP SCP QC3
Connect the iPhone to be repaired to i2C Assistant to flash the phone and unbind the factory code
and then swipe both sides of the screen with a blade
JTX Swap Board CPU Chip Reballing Platform for iPhone 8-16 Pro Max Machine vision camera Line Lenght≈420mmJTX SM 01 Swap Master 30 in 1 Tinning Platform with BGA stencil for iPhone 8 16 Pro Max motherboard replacement and CPU BGA chip reballing. Super Magnetic Positioning Tinning Platform for iPhone PCB board swapping chips rapid positioning, allows for reballing of multiple chip sizes at once, and the strong magnetism aids the reballing process, ensuring optimal solder component placement. Option: 1. SM 01: For iPhone 8 8P X Qualcomm. 2. SM 02: For
US$ 29.95
US$ 16.95
US$ 22.95
US$ 19.95
