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RELIFE RL-601MA A11-A19 PRO Universal CPU Reballing Stencil Platform Option:A11-A19 Set Huawei BLN-AL10 32GB [Huawei Berlin]

SKU: 73377614599

4.1
USD15.99 USD55.99

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Ships within 48 hours · Estimated delivery Sep 2 - Sep 7

Description

Huawei BLN-AL10 32GB [Huawei Berlin]

The new mobile apps are already on display in the Google Play Store and the Apple App Store

Laminating parameters:

Operation mode: manual mode

1x iPhone 15 series 4 in 1 heating mold with stencil

RELIFE RL-601MA A11-A19 PRO Universal CPU Reballing Stencil Platform Option:A11-A19 Set Huawei BLN-AL10 32GB [Huawei Berlin]Sunshine Relife RL 601MA A11 A19 Pro CPU Planting Tin Universal Reballing Platform with stencil for iPhone 8 17 Pro Max. Precise automatic alignment, universal CPU chip slot and integration positioning for A11 A12 A13 A14 A15 A16 A17 A18 A19 CPU reballing and glue removal. Features: 1. Relife RL 601MA CPU tin planting platform set suitable for Apple iPhone A11 A12 A13 A14 A15 A16 A17 A18 A19 Pro CPU soldering repair. 2. Round and square precise hole

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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