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Ships within 48 hours · Estimated delivery Sep 6 - Sep 11
12mm SR2ZY/EN/EM CPU BGA reballing stencil plant tin steel net
San Francisco
Note: When you got device you can use it directly without need upgrade
Note: Use 0
The model of the EFI chip will be recognized automatically
MECHANIC XZ25/XZW25 BGA Solder Balls Motherboard Repair Tool Size:XZ25 0.20mm 12mm SR2ZY/EN/EM CPU BGA reballingMECHANIC Have Lead Welding Tin Bead Motherboard Chip Hard Disk Baseband Repair Soldering Tin Ball Repair Tools MECHANIC solder ball 25000PCS Bottle Notice: XZ25 is Lead solder ball, XZW25 is Lead free Solder ball. The BGA solder ball has the following characteristics: Meet EU ROHS and REACH standards. With high reliability, excellent mechanical properties, good thermal fatigue resistance and oxidation resistance. Purity and sphericity are very high,
