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Ships within 48 hours · Estimated delivery Sep 4 - Sep 9
All-In-One Thin-Type Finger Vein Module
and digital signature module to meet the security requirements of the IoT
4 GHz RF SoC designed for ULP (ultra low power) wirelesss applications
The online platform contains all the content you need to teach remotely: exclusive learning guidance content
Smart Factory Application
reComputer Mini J501 Carrier Board for Jetson AGX Orin™ with GMSL Extension tf card All-In-One Thin-Type Finger Vein ModulereComputer Mini J501 Carrier Board for Jetson AGX Orin with GMSL Extension Powerful embodied AI Platform Compatible with the Jetson AGX Orin module, offering up to 275 TOPS. Perfect platform for embodied AI development. Ultra Compact Size 110mm x 110mm footprint, suitable for robot prototyping and development, especially robots that has tight footprint such as humanoids Wide Voltage Input Range Can be used in 48V battery power system (max 54V input)
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